Thermal management market is projected to grow at a CAGR 6.49% rate during the forecast period. Major factors driving the market includes rising demand for effective thermal management solutions and systems in consumer electronics; increasing use of electronic devices in different end-use industries; and ongoing radical miniaturization of electronic devices.Non-adhesive thermal management material is expected to hold the largest share. Non-adhesive materials such as thermal pads, gap fillers, and grease are used widely in consumer electronics such as computers, laptops, and other handheld devices such as tablets. Thermal pads are used to fill the gaps between heat sinks and microprocessors. They eliminate air gaps to reduce thermal resistance and provide low-stress vibration dampening.
Convection cooling devices expected to hold the largest market share. These devices of in thermal management are increasingly being used in electronic components, electronic circuits, and PCBs. These devices help lower the peak temperature of different systems where they are installed with natural and forced convection cooling technologies. Devices such as loop heat pipes, heat pumps, heat sinks, and heat spreaders are used for effective cooling of processors and computers, among others.
Consumer electronics is expected to hold the largest market share. Thermal management solutions are used prominently in several consumer electronics such as personal computers, laptops, smartphones, and gaming devices. Thermal management in consumer electronics involves chip cooling to protect electronic components such as processors and transistors from overheating. For multi-core processors, the noise can be avoided by using large heat sinks, heat pipes, and cooling fans.
Asia Pacific region has emerged as a global focal point for large investments and business expansion opportunities.Increasing demand for effective thermal management solutions and systems from consumer electronics, automotive, defense, and healthcare sectors is also fueling the growth of the market in APAC.
Key players in the market include Honeywell International Inc. (US), Aavid Thermalloy LLC. (US), Vertiv Co. (US), European Thermodynamics Ltd. (UK), and Master Bond Inc. (US), Advanced Cooling Technologies, Inc. (US), Dau Thermal Solutions Inc. (US), Amerasia International Technology Inc. (US), Heatex AB (Sweden), and Parker Chomerics (US).
Key Questions Addressed by the Report
- Where will all these developments take the industry in the mid- to long-term?
- What are the upcoming industries for thermal management applications?
- Who are the important players in the market?
- What are the upcoming products and technologies in the market?
- What are the major drivers, restraints, opportunities, and challenges for the thermal management market?
- Introduction
- Market Definition
- Study Scope
- Study Period
- Market Stakeholders
- Research Methodology
- Secondary Research
- Primary Research
- Research Design
- Data Validation
- Limitations and Assumptions
- Market Dynamics
- Drivers
- Rising Demand for Effective Thermal Management Solutions and Systems in Consumer Electronics
- Increasing use of Electronic Devices in Different End-Use Industries
- Ongoing Radical Miniaturization of Electronic Devices
- Challenges
- Design Complexities of Components Used in Cooling Systems
- High Development Costs of Customized Thermal Management Solutions and Systems
- Opportunities
- Technological Advancements Such as the Development of Synthetic Cooling Systems and Interface Materials
- Advent of Cool Chips for Thermal Management in Electronic Devices
- Increased Demand for Natural Refrigerants
- Executive Summary
- Thermal Management Market, By Material Type
- Adhesive materials
- Tapes
- Films
- Thermally conductive films
- Electrically conductive films
- Adhesive liquids
- Heat cure liquids
- Room temperature cure liquids
- Non-adhesive materials
- Thermal pads
- Gap fillers
- Phase change materials
- grease
- Thermal Management Market, By Device
- Conduction cooling devices
- Wedge locks
- Potting materials
- Convection cooling devices
- Heat sinks
- Heat spreaders
- Forced air and natural cooling devices
- Heat pumps
- Advanced cooling devices
- Direct immersion cooling
- Microchannel cooling
- Cold plates
- Others
- Hybrid cooling devices
- Electrowetting devices
- Spot coolers
- Vapor chambers
- Compact heat exchangers
- Thermoelectric cooling
- Others
- Thermal Management Market, By Service
- Installation and calibration
- Optimization and post-sales support
- Thermal Management Market, By End-Use Industry
- Consumer electronics
- Laptops and computers
- Audio amplifier components
- Power supply units
- Gaming devices
- Smartphones
- Home appliances
- Servers and data centers
- Single racks
- Multi racks
- Automotive
- Battery thermal management systems
- Engine control thermal management systems
- Waste heat recovery and emission reduction systems
- Brake and suspension cooling systems
- Seat heating and cooling systems
- Aerospace and defense
- Enterprises
- Healthcare
- Large infrastructure equipment
- Portable equipment
- others
- Thermal Management Market, By Region
- North America
- US
- Canada
- Mexico
- Europe
- UK
- Germany
- The Netherlands
- France
- Italy
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- South Korea
- Rest of APAC
- Rest of the World
- Company Profiles
- Leading Companies in Thermal Management Market
- Honeywell
- Aavid Thermalloy (Boyd Corporation)
- Vertiv
- European Thermodynamics
- Henkel
- Master Bond
- Laird
- Delta Electronics
- Advanced Cooling Technologies, Inc.
- Parker (Chomerics Division)
- Other Companies in Thermal Management Market
*Company introduction, financial information, recent developments, SWOT analysis
- Conclusion and Recommendations
- Appendix
- About
- Related Reports
- Glossary
