Thermal Management Market
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Thermal management market is projected to grow at a CAGR 7.48% rate during the forecast period. Major factors driving the market includes rising demand for effective thermal management solutions and systems in consumer electronics; increasing use of electronic devices in different end-use industries; and ongoing radical miniaturization of electronic devices.
Non-adhesive thermal management material is expected to hold the largest share. Non-adhesive materials such as thermal pads, gap fillers, and grease are used widely in consumer electronics such as computers, laptops, and other handheld devices such as tablets. Thermal pads are used to fill the gaps between heat sinks and microprocessors. They eliminate air gaps to reduce thermal resistance and provide low-stress vibration dampening.
Convection cooling devices expected to hold the largest market share. These devices of in thermal management are increasingly being used in electronic components, electronic circuits, and PCBs. These devices help lower the peak temperature of different systems where they are installed with natural and forced convection cooling technologies. Devices such as loop heat pipes, heat pumps, heat sinks, and heat spreaders are used for effective cooling of processors and computers, among others.
Consumer electronics is expected to hold the largest market share. Thermal management solutions are used prominently in several consumer electronics such as personal computers, laptops, smartphones, and gaming devices. Thermal management in consumer electronics involves chip cooling to protect electronic components such as processors and transistors from overheating. For multi-core processors, the noise can be avoided by using large heat sinks, heat pipes, and cooling fans.
Asia Pacific region has emerged as a global focal point for large investments and business expansion opportunities.Increasing demand for effective thermal management solutions and systems from consumer electronics, automotive, defense, and healthcare sectors is also fueling the growth of the market in APAC.
Key players in the market include Honeywell International Inc. (US), Aavid Thermalloy LLC. (US), Vertiv Co. (US), European Thermodynamics Ltd. (UK), and Master Bond Inc. (US), Advanced Cooling Technologies, Inc. (US), Dau Thermal Solutions Inc. (US), Amerasia International Technology Inc. (US), Heatex AB (Sweden), and Parker Chomerics (US).
Key Questions Addressed by the Report
- Where will all these developments take the industry in the mid- to long-term?
- What are the upcoming industries for thermal management applications?
- Who are the important players in the market?
- What are the upcoming products and technologies in the market?
- What are the major drivers, restraints, opportunities, and challenges for the market?
2. Research Methodology
Limitation and Assumptions
3. Executive Overview
4. Market Overview
5. Thermal Management Market, By End-Use Industry
Servers and data centers
Aerospace and defense
6. Thermal Management Market, By Device
Convection cooling devices
Conduction cooling devices
Advanced cooling devices
Hybrid cooling devices
7. Thermal Management Market, By Service
Installation and calibration
Optimization and post-sales support
8. Thermal Management Market, By Material Type
9. Thermal Management Market, By Region
Rest of Europe
Rest of APAC
Rest of Middle East
Rest of the World
10. Company Profiles
Parker (Chomerics Division)
Advanced Cooling Technologies, Inc.
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