Thermal Management Market

Thermal Management Market



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Thermal management market is projected to grow at a CAGR 7.48% rate during the forecast period. Major factors driving the market includes rising demand for effective thermal management solutions and systems in consumer electronics; increasing use of electronic devices in different end-use industries; and ongoing radical miniaturization of electronic devices.

Non-adhesive thermal management material is expected to hold the largest share. Non-adhesive materials such as thermal pads, gap fillers, and grease are used widely in consumer electronics such as computers, laptops, and other handheld devices such as tablets. Thermal pads are used to fill the gaps between heat sinks and microprocessors. They eliminate air gaps to reduce thermal resistance and provide low-stress vibration dampening.

Convection cooling devices expected to hold the largest market share. These devices of in thermal management are increasingly being used in electronic components, electronic circuits, and PCBs. These devices help lower the peak temperature of different systems where they are installed with natural and forced convection cooling technologies. Devices such as loop heat pipes, heat pumps, heat sinks, and heat spreaders are used for effective cooling of processors and computers, among others.

Consumer electronics is expected to hold the largest market share. Thermal management solutions are used prominently in several consumer electronics such as personal computers, laptops, smartphones, and gaming devices. Thermal management in consumer electronics involves chip cooling to protect electronic components such as processors and transistors from overheating. For multi-core processors, the noise can be avoided by using large heat sinks, heat pipes, and cooling fans.

Asia Pacific region has emerged as a global focal point for large investments and business expansion opportunities.Increasing demand for effective thermal management solutions and systems from consumer electronics, automotive, defense, and healthcare sectors is also fueling the growth of the market in APAC.

Key players in the market include Honeywell International Inc. (US), Aavid Thermalloy LLC. (US), Vertiv Co. (US), European Thermodynamics Ltd. (UK), and Master Bond Inc. (US), Advanced Cooling Technologies, Inc. (US), Dau Thermal Solutions Inc. (US), Amerasia International Technology Inc. (US), Heatex AB (Sweden), and Parker Chomerics (US).

Key Questions Addressed by the Report

  • Where will all these developments take the industry in the mid- to long-term?
  • What are the upcoming industries for thermal management applications?
  • Who are the important players in the market?
  • What are the upcoming products and technologies in the market?
  • What are the major drivers, restraints, opportunities, and challenges for the market?


Market Definition

Study Scope

Study Period


2. Research Methodology

Secondary Research

Primary Research

Research Design

Data Validation

Limitation and Assumptions

3. Executive Overview

4. Market Overview





5. Thermal Management Market, By End-Use Industry

Consumer electronics

Servers and data centers


Aerospace and defense




6. Thermal Management Market, By Device

Convection cooling devices

Conduction cooling devices

Advanced cooling devices

Hybrid cooling devices

7. Thermal Management Market, By Service

Installation and calibration

Optimization and post-sales support

8. Thermal Management Market, By Material Type

Adhesive materials


9. Thermal Management Market, By Region

North America









    Rest of Europe

Asia Pacific



     South Korea



     Rest of APAC

Middle East


     Saudi Arabia

     Rest of Middle East

Rest of the World

     Latin America


10. Company Profiles

Aavid Thermalloy

European Thermodynamics

Master Bond

Delta Electronics

Parker (Chomerics Division)





Advanced Cooling Technologies, Inc.

11. Appendix



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